By 2031, the global Substrate-Like PCB (SLP) Market is anticipated to reach a stunning worth of $5,983.6 million, growing at a steady annual rate of 14.9% from 2021 to 2031. This remarkable expansion can be ascribed to a number of important elements that are reshaping the business environment.
With its speedier gearbox capabilities and increased design freedom for manufacturers, SLP technology has emerged as a game-changer. The number of research and development projects geared at advancing SLP technology has increased as a result. In addition, the expanding use of smart consumer goods, such as smartphones and wearable technology, has considerably increased the demand for SLP. SLP has established itself as a trustworthy option, fueling the growth of the industry as need for efficient connectivity solutions increases. The demand for tiny electronic components has also increased due to the miniaturisation trend, supporting the expansion of the SLP industry.
As the global substrate-like PCB market grows, market participants are ready to take advantage of the strong demand and take advantage of the lucrative opportunities offered by this burgeoning sector
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Global substrate-like PCB (SLP) market will reach $5,983.6 million by 2031, growing by 14.9% annually over 2021-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization.
Highlighted with 78 tables and 69 figures, this 144-page report “Global Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
- Market Structure
- Growth Drivers
- Restraints and Challenges
- Emerging Product Trends & Market Opportunities
- Porter’s Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Region.
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Based on Inspection Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Automated Optical Inspection (AOI)
- Direct Imaging (DI)
- Automated Optical Shaping (AOS)
Based on Line/Space, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- 25/25 and 30/30 μm
- Less than 25/25 μm
By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
- Consumer Electronics
- Automotive Industry
- Medical Industry
- Industrial Use
- Computing and Communications
- Other Applications
Geographically, the following regions together with the listed national/local markets are fully investigated:
- North America (U.S., Canada, and Mexico)
- Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
- APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
- South America (Brazil, Chile, Argentina, Rest of South America)
- MEA (UAE，Saudi Arabia， South Africa and Rest of MEA)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Inspection Technology, Line/Space and Application over the forecast years are also included.
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The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
View Report Scope and Latest Developments in the Market: https://www.marketwatch.com/press-release/substrate-like-pcb-slp-market-driven-by-technological-advancements-and-rising-demand-for-connectivity-solutions-2023-06-03?mod=search_headline
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